Battery Pack Interconnect

Explore the Possibilities

Battery Pack Interconnect

Explore the Possibilities
Best-in-class battery interconnects for cutting-edge applications.
Passenger Vehicles
Commercial Vehicles
Industrial Vehicles
Aerospace/Defense
Stationary Energy Storage
Stationary Energy Storage
Grid Scale

CelLink’s high-conductance circuits integrate bussing, power cabling, voltage monitoring, temperature monitoring, and fusing systems in the Current Collector Assembly+ (CCA+) Platform

The Technology

CelLink’s CCA+ technology integrates all critical interconnect functions into a single flex circuit, revolutionizing battery design and performance, all with zero design-specific tooling.

These benefits result in lower tooling costs, labor/assembly costs, and lower weight than traditional interconnects.

Prismatic CCA+

Optimized for prismatic cells, this solution delivers efficient power distribution and simplified assembly for high-density battery packs.

Cylindrical CCA+

Designed for cylindrical cells, this configuration provides reliable connectivity, robust thermal performance, and scalable integration.

Voltage Sense Harness

A compact, high-performance solution for voltage sensing, cell and pack balancing, temperature sensing, and fusing
Closer look at the Technology
CelLink's CCA+ technology combines world-class performance and unbeatable design freedom, solving technical and commercial challenges like no other interconnect solution in existence.
Bussing
Cell-agnostic bussing layers patterned at custom thicknesses and widths to dial-in current carrying to minimize mass and height.
Voltage Sensing
Integrated voltage sensing directly in the current collector layer stack, eliminating external VSH costs and the associated weld points, and enabling Aluminum sensing traces
Temperature sensing
Laser-welded PCBA-based NTCs to allow for custom temp-sensing - at cell busbars or touching the body of the cells
Fusing
Patterned-in cell-level and sensing-trace fusing, patterned to customer-specific ratings (current ratings, duration)
Z-height deflection features
Account for variation in cell height tolerance by independently allowing each busbar to move up or down at a prescribed distance to ensure intimate contact for laser welding.
Drive unit cabling
Uses the space in between cells, and the metal layers that are already present in the stack, to integrate drive unit cabling, eliminating external busbars or round wire. Direct-attach to header terminals, bolted, or welded.
Auxiliary power cabling
Take current to eAC and other auxiliary outputs in the pack utilizing in-plane power flex, reducing Z-height and eliminating assembly steps
Eyelet terminals
Eyelet terminals for convenient power connections
Vent gas channels
Provide preferential paths for venting gas via integrated Aluminum channels, further simplifying the pack assembly and BOM
OverviewBussingVoltage SensingTemperature sensingFusingZ-height deflection featuresDrive unit cablingAuxiliary power cablingEyelet terminalsVent gas channels

Installation

CelLink materials are engineered for compatibility with automated assembly lines, enabling efficient integration into existing robotic and high-throughput manufacturing systems. Their mechanical and thermal properties support precise, repeatable installation across a range of industrial environments.

Laser Weld

Resistance Weld

Wire Bonder

Product Specifications

Materials

  • Dielectric Option
    • PET, PEN, PP, V0, HB
    • Al for EMI shielding
  • Conductors
    • Cu: 35–500 μm
    • Al: 50–800 μm
    • Ni-plated Al
    • Tin-plated Cu
    • Supports multi-layer conductor circuits to expand functionality

Connection and Termination

  • Termination Methods
    • Laser-welded SMT connectors,
    • Eyelet terminals and washers
    • Wave-soldered connectors
    • Patterned bolt holes
    • Direct connect to PCBA
    • Direct welded
    • Direct wire-bonded

Integrated Features

  • Fusing
    • Voltage sensing
    • Cell-level Protection
  • Temperature Sensing
    • Al circuits: PCBA-mounted NTCs
    • Cu circuits: SMT-mounted NTCs
  • Cabling
    • High-volume support for drive units,
    • Auxiliary power
    • Module-to-module bussing
  • Z-Height Deflection
    • Integrated vertical compliance features
  • Vehicle Attachment
    • Pressure-sensitive adhesive (PSA)
    • Brackets, clips, or other mechanical options
  • Protection
    • Strain Relief
    • Sealing

Connector 
Compatibility

Engineered for maximum interoperability, our products are compatible with a wide range of high-speed, fine-pitch connector systems.

Designed to accommodate leading board-to-board and mezzanine interface standards, they ensure seamless integration with popular series from Panasonic, Hirose, Molex, Samtec, JAE, and more.
High Voltage
Low Voltage

High Voltage

CelLink CCS 2-Way
Features
Low-profile, HVIL safety, sealed housing, EMI shielding, orange HV compliant
Signal Support
Power + HVIL (optional)
Pin Count
2+2
Pitch
28mm
Packaging Height
26mm
Kostal KS22
Features
High-current blades, copper busbar, low resistance
Signal Support
Power only
Pin Count
1
Pitch
Packaging Height
~32mm
Aptiv/TE BCON+ (1-Way)
Features
Sealed bolted connection, orange HV compliant
Signal Support
Power only
Pin Count
1
Pitch
Packaging Height
Aptiv HV 2-way
Features
HVIL safety, sealed housing, EMI shielding, orange HV compliant
Signal Support
Power + HVIL (optional)
Pin Count
2+2
Pitch
~30mm
Packaging Height
~80mm
Lear HC 14.5
Features
High-current blades, copper busbar, low resistance
Signal Support
Power only
Pin Count
1
Pitch
Packaging Height

Low Voltage

CelLink CCS 48v Backbone System
Features
Sealed Power Backbone, 48V, Optional CPA
Signal Support
LV Analog, Power
Pin Count
1
Pitch
Packaging Height
31mm
Lear HC 6.3 Terminal
Features
High-current blades, copper busbar, low resistance
Signal Support
LV Analog, Power
Pin Count
1
Pitch
Packaging Height
Panasonic CF1
Features
Single-row horizontal or vertical plug with horizontal or vertical receptacle, power+data flexibility
Signal Support
LV Analog, LVDS, CAN, GMSL
Pin Count
2-10
Pitch
2.2mm
Packaging Height
6.48mm
Molex Through Pin Solder
Features
Through Hole Vertical Header
Signal Support
LV Analog, LVDS, CAN, LIN
Pin Count
2-16
Pitch
2.5mm
Packaging Height
~20mm
Panasonic CF3
Features
Double-row horizontal or vertical plug with horizontal or vertical receptacle, power+data flexibility, optional CPA
Signal Support
LV Analog, LVDS, CAN, GMSL
Pin Count
20-40
Pitch
2.4mm
Packaging Height
12mm
Samtech IPS/IPx Series
Features
Compact SMT, dual-row, robust contacts, high-speed optimized
Signal Support
LV Analog, LVDS, FPD-Link, CAN, GMSL
Pin Count
36
Pitch
2.54mm
Packaging Height
20mm