Data Center

Explore the Possibilities

Data Center

Explore the Possibilities
CelLink PowerPlane™ delivers thousands of amps through a space efficient, flexible power circuit.
Passenger Vehicles
Commercial Vehicles
Industrial Vehicles
Aerospace/Defense
Servers
Stationary Energy Storage - Residential/Commercial

CelLink PowerPlane™

Disruptive power delivery geometries unlock new paths of electrical and cooling architectures. Flat and flexible conductors enable better space utilization, higher capacitance, lower inductance, and improved automation than traditional cabling. Road-tested technology that is ready for the AI Factory.

Efficient, high power delivery to GPUs, CPUs and active components

Integrated liquid cooling plate

Ultra thin and flexible form factor (<3mm)

Download Technical Brief

Innovative power delivery unlocks a revolution in data center infrastructure.

CelLink PowerPlane™ delivers thousands of amps through a space efficient, flexible power circuit.

The Technology

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Type 1

Description

Closer look at the technology
CelLink PowerPlane™ delivers thousands of amps through a space efficient, flexible power circuit.
Power delivery to ASICs
Ultrathin (<3mm), high current (thousands of amps), multi-voltage levels (up to 1000V) flex circuit that provides power to GPUs, CPUs and other active components.
Integrated Liquid Cooling
The PowerPlane™ spreads and removes heat through an ultra thin (1.5mm) aluminum liquid cooling plate.
Customizable Cooling Plate
Liquid cooling channels can be re-routed to hot spots and customized for individual design requirements.
Integrated Voltage Sensing
Conforms to OCP requirements with a voltage sensing circuit integrated directly into the PowerPlane™ layer stack.
OverviewPower delivery to ASICsIntegrated Liquid CoolingCustomizable Cooling PlateIntegrated Voltage Sensing

Product Specifications

Materials

  • Dielectric Option
    • PET, PEN, PP, V0, HB
    • Al for EMI shielding
  • Conductors
    • Cu: 35–500 μm
    • Al: 50–800 μm
    • Ni-plated Al
    • Tin-plated Cu
    • Supports multi-layer conductor circuits to expand functionality

Connection and Termination

  • Termination Methods
    • Laser-welded SMT connectors
    • Eyelet terminals and washers
    • Wave-soldered connectors
    • Patterned bolt holes
    • Direct connect to PCBA
    • Direct welded
    • Direct wire-bonded

Integrated Features

  • Voltage Sense
    • Sense Pin contacts enable 'mate last-break first' capability
  • Optional Temperature Sensing
    • Al circuits: PCBA-mounted NTCs
    • Cu circuits: SMT-mounted NTCs
  • Chassis Attachment
    • Pressure-sensitive adhesive (PSA)
    • Brackets, clips, or other mechanical options
  • Protection
    • Strain Relief
    • Sealing

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Connector 
Compatibility

Engineered for maximum interoperability, our products are compatible with a wide range of high-speed, fine-pitch connector systems.

Designed to accommodate leading board-to-board and mezzanine interface standards, they ensure seamless integration with popular series from Panasonic, Hirose, Molex, Samtec, JAE, and more.
Engineered for maximum interoperability, our connectors are optimized for OCP-compliant server environments. They support dense layouts and stable signal performance to meet the demands of modern server architectures.
High Voltage
Low Voltage

High Voltage

48V Busbar Clip
Features
Up to 220A Sense Pin Contacts
Signal Support
Power & Sense
Pin Count
Pitch
Packaging Height
CelLink CCS 2-Way
Features
Low-profile, HVIL safety, sealed housing, EMI shielding, orange HV compliant
Signal Support
Power + HVIL (optional)
Pin Count
2+2
Pitch
28mm
Packaging Height
26mm
Kostal KS22
Features
High-current blades, copper busbar, low resistance
Signal Support
Power only
Pin Count
1
Pitch
Packaging Height
~32mm
Aptiv/TE BCON+ (1-Way)
Features
Sealed bolted connection, orange HV compliant
Signal Support
Power only
Pin Count
1
Pitch
Packaging Height
Aptiv HV 2-way
Features
HVIL safety, sealed housing, EMI shielding, orange HV compliant
Signal Support
Power + HVIL (optional)
Pin Count
2+2
Pitch
~30mm
Packaging Height
~80mm
Lear HC 14.5
Features
High-current blades, copper busbar, low resistance
Signal Support
Power only
Pin Count
1
Pitch
Packaging Height

Low Voltage

CelLink CCS 48v Backbone System
Features
Sealed Power Backbone, 48V, Optional CPA
Signal Support
LV Analog, Power
Pin Count
1
Pitch
Packaging Height
31mm
Lear HC 6.3 Terminal
Features
High-current blades, copper busbar, low resistance
Signal Support
LV Analog, Power
Pin Count
1
Pitch
Packaging Height
Panasonic CF1
Features
Single-row horizontal or vertical plug with horizontal or vertical receptacle, power+data flexibility
Signal Support
LV Analog, LVDS, CAN, GMSL
Pin Count
2-10
Pitch
2.2mm
Packaging Height
6.48mm
Molex Through Pin Solder
Features
Through Hole Vertical Header
Signal Support
LV Analog, LVDS, CAN, LIN
Pin Count
2-16
Pitch
2.5mm
Packaging Height
~20mm
Panasonic CF3
Features
Double-row horizontal or vertical plug with horizontal or vertical receptacle, power+data flexibility, optional CPA
Signal Support
LV Analog, LVDS, CAN, GMSL
Pin Count
20-40
Pitch
2.4mm
Packaging Height
12mm
Samtech IPS/IPx Series
Features
Compact SMT, dual-row, robust contacts, high-speed optimized
Signal Support
LV Analog, LVDS, FPD-Link, CAN, GMSL
Pin Count
36
Pitch
2.54mm
Packaging Height
20mm

Designed for Servers

48V Busbar Clip
Features

Up to 220A

Sense Pin Contacts

OCP-compliant

Signal Support
Power & Sense
Pin Count
Pitch
Packaging Height
Amphenol Radsok
Features

Up to 200A per pin

Tool-less assembly

Signal Support
Power only
Pin Count
Pitch
Packaging Height
OCP PICPWR Hybrid Connector
Features

PICPWR-compliant

Multiple P&S configurations

Signal Support
Power only
Pin Count
Pitch
Packaging Height